Asian Tech Press (Mar. 21) -- TSMC's fifth packaging and testing plant AP6, located in Zhunan, will be put into mass production in the third quarter of this year.

This time, in addition to the existing 2D/2.5D packaging, a large-scale 3D packaging mass production program will also be carried out.

The total area of the plant is reportedly 1.3 times larger than the total area of the company's four remaining packaging plants, and is TSMC's largest production base for advanced 3D packaging.