SK Hynix to break ground on new U.S. chip packaging plant in Q1 2023

Asian Tech Press (Aug 12) -- South Korean chipmaker SK Hynix Inc. will break ground on a new chip packaging plant in the U.S. around the first quarter of next year, sources said.

SK Hynix plans to build a state-of-the-art chip packaging plant in the United States, two people familiar with the matter said, and reak ground on the plant around the first quarter of 2023.

One of the sources said the plant expected to cost billions of dollars, will achieve mass production by 2025-2026, and will employ about 1,000 workers.

Despite the latest news on SK Hynix's new U.S. chip packaging plant, the company has indefinitely postponed plans to expand one of its memory chip plants in South Korea.

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