Samsung begins mass production of 3nm chips, overtaking TSMC
▲ (From left) Michael Jeong, Corporate Vice President; Ja-Hum Ku, Corporate Executive Vice President; and Sang Bom Kang, Corporate Vice President at Samsung Foundry Business are holding up 3nm wafers at the production line of Samsung Electronics Hwaseong Campus.

Asian Tech Press (June 30) -- Samsung announced the mass production of 3nm chips, turning the tables on its foundry rival and industry leader TSMC.

Samsung Electronics announced Thursday that it has begun mass production of 3nm chips at its Hwaseong plant in South Korea, making it the first company in the world to mass produce 3nm chips.

The move also means that Samsung is the first to move into the 3nm stage, and the process technology has achieved the overtaking of TSMC.

Unlike previous generations of chips using fin field-effect transistor (FinFET) architecture, Samsung applied Gate-All-Around (GAA) transistor architecture on its 3nm chips, which greatly improves power efficiency.

Samsung said its second-generation 3nm process is to reduce power consumption by up to 50%, improve performance by 35% and reduce area by 45%, which is better than TSMC's 3nm process with FinFET architecture.

Arisa Liu, a research fellow at the Taiwan Institute of Economic Research (TIER), said that Samsung has still not actually received orders for 3nm chips, and it is not very significant to announce mass production of 3nm chips.

The researcher stressed that, in contrast, TSMC has already secured orders for its 3nm process from Apple, Intel and other customers, and would achieve mass production in the second half of the year.

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